Optical type inspection apparatus, inspection system and the wafer for coordinates management

An optical type inspection apparatus including a line sensor with plural channels capable of forming an image of a surface of a wafer, the channels being arrayed with equal intervals along Y axis direction, and a transporting unit that forms an image of an entire surface of the wafer on the channels by loading the wafer on a stage and repeatedly transporting, relatively to the line sensor, the wafer along X axis direction perpendicular to the Y axis direction, wherein the optical type inspection apparatus inspects the surface of the water, the optical type inspection apparatus comprising:

• a stage position detecting unit, wherein,
• when a wafer for coordinates management has been arranged such that:
• a matrix is set on the surface;
• one pseudo defect die is formed on each row of the matrix and one pseudo defect die is formed on each column of the matrix;
• and
• plural pseudo defects are formed in the each pseudo defect die in one array along a column direction with equal intervals such that a pitch between formed images, of the pseudo defects, on the channels is the same as a pitch between the channels,
• and if the wafer for coordinates management has been inspected as the wafer such that the Y axis direction and the column direction are substantially parallel to each other and an image of one pseudo defect is formed on the each channel, corresponding to the each pseudo defect die,
• then the stage position detecting unit detects a position, on the stage, of the each pseudo defect whose image has been formed on the corresponding channel, as a pseudo defect stage coordinate;
• a coordinate transforming unit that transforms the each detected pseudo defect stage coordinate into a pseudo defect die coordinate representing a position in the pseudo defect die that includes the pseudo defect;
• a difference computing unit that computes difference of the each pseudo defect die coordinate from a designed coordinate based on design, wherein the difference is generated when the pseudo defect is formed in the corresponding defect die;
• and
• a characteristic pattern obtaining unit that obtains at least either one of a coordinate error characteristic pattern in which the difference vibrates with a substantially constant amplitude with respect to the pseudo defect stage coordinate and a coordinate error characteristic pattern in which the difference increases or decreases along a line.