Fixture planarity evaluation method

A method of measuring planarity of two components of a semiconductor processing tool comprising:

• compressing a first wafer with the semiconductor processing tool, wherein the first wafer is secured in a first fixture, and wherein the first wafer comprises a plurality of solder balls on a surface of the first wafer, and wherein a second fixture holds a second wafer, such that the second wafer compresses the solder balls of the first wafer;
• measuring deformity of multiple solder balls from the plurality of solder balls;
• and
• determining the planarity of the first fixture with respect to the second fixture.

A method of measuring planarity of two components of a semiconductor processing tool comprising:

• heating a wafer to a temperature ranging from 260 degrees Celsius to 275 degrees Celsius, wherein the wafer comprises between 90,000 and 100,000 solder balls on a surface of the wafer;
• compressing a wafer secured in a first fixture of the semiconductor processing tool, wherein the wafer is compressed with a second fixture of the semiconductor processing tool;
• measuring deformity of multiple solder balls on the wafer;
• and
• determining planarity of the first fixture with respect to the second fixture.