Camera module
AssigneeLG Innotek Co., Ltd.
InventorSangyun OH
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AssigneeLG Innotek Co., Ltd.
InventorSangyun OH
Estimating the term…
A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have first coils wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB; and buffer units provided at the connection units of the wire springs and the third PCB and configured to surround the connection units of the wire springs and the third PCB.
An OIS (Optical Image Stabilization) unit, comprising:
A camera module, comprising an image sensor, a lens and an OIS (Optical Image Stabilization) unit, the OIS unit including,
Dependencies are inferred from the claim text.