Semiconductor device

A semiconductor device comprising:

• a semiconductor substrate having a semiconductor element;
• an interlayer insulation film disposed above the semiconductor substrate;
• a plurality of wiring layers disposed within the interlayer insulation film;
• a first hard film disposed above the interlayer insulation film, the first hard film being harder than the interlayer insulation film;
• and
• an electrical pad disposed above the first hard film and used for an external connection,
• wherein the electrical pad includes:
• a lower layer pad disposed closer to the semiconductor substrate;
• an upper layer pad disposed further from the semiconductor substrate;
• and
• a second hard film disposed between the lower layer pad and the upper layer pad, and
• wherein the second hard film has conductivity and is harder than the lower layer pad and the upper layer pad.