Wiring material and semiconductor module using the same

A wiring material, comprising:

• a core layer made of metal;
• and
• a clad layer made of metal and a fiber, wherein
• the core layer is copper or an alloy containing copper,
• the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than a thermal expansion coefficient of copper,
• the wiring material has a stacked structure in which at least one surface of the core layer is closely adhered to the clad layer,
• the fiber in the clad layer is arranged so as to be parallel to the surface of the core layer,
• the fiber includes a fiber layer formed of a fiber arranged so as to be parallel to one direction and the fiber arranged in a direction perpendicular to the fiber arranged so as to be parallel to the one direction, and
• volume density of the fiber in the fiber layer increases with distance from the core layer in a stacking direction in the wiring material.

Semiconductor equipment, comprising:

• a wiring material including a core layer made of metal and a clad layer made of metal and a fiber;
• a semiconductor device including an electrode;
• and
• an insulating circuit substrate including a metal layer, wherein
• the clad layer is formed of copper or an alloy containing copper and a fiber having a thermal expansion coefficient lower than a thermal expansion coefficient of copper,
• the wiring material has a stacked structure in which at least one surface of the core layer is closely adhered to the clad layer,
• the semiconductor device is mounted on the insulating circuit substrate,
• an electrode of the semiconductor device and the core layer of the wiring material are connected to each other through the clad layer,
• the metal layer of the insulating circuit substrate and the core layer of the wiring material are connected to each other through the clad layer,
• the fiber in the clad layer is arranged so as to be parallel to the surface of the core layer,
• the fiber includes a fiber layer formed of a fiber arranged so as to be parallel to one direction and the fiber arranged in a direction perpendicular to the fiber arranged so as to be parallel to the one direction, and
• volume density of the fiber in the fiber layer increases with distance from the core layer in a stacking direction in the wiring material.