Forming Interconnect Structures Using Pre-Ink-Printed Sheets

A device, comprising:

• a substrate having a through-substrate via (TSV) extending through a first side of the substrate to a second side of the substrate opposite the first side;
• a first dielectric sheet having a first through-hole with a size greater than the size of a top portion of the TSV, wherein the first dielectric sheet is bonded to the first side of the substrate, wherein the TSV extends into the first through-hole without extending laterally over the first side of the substrate, and wherein the top portion of the TSV fits into the first through-hole;
• first conductive patterns printed on the first dielectric sheet, the first conductive patterns comprising a conductive ink;
• and
• a first conductive material disposed over the first through-hole and over a portion of the TSV in the through-hole, the first conductive material electrically coupling the first conductive patterns to the TSV.

A device, comprising:

• a substrate having a through-substrate via (TSV) extending through a first side of the substrate to a second side of the substrate opposite the first side, a TSV bump of the TSV extending above the first side of the substrate;
• a plurality of dielectric sheets, each of the plurality of dielectric sheets having a through-hole, the plurality of dielectric sheets stacked over and bonded to the first side of the substrate, wherein a first through-hole of a bottommost dielectric sheet of the plurality of dielectric sheets has a size greater than the size of the TSV bump, wherein the TSV bump extends into the first through-hole without extending laterally over the first side of the substrate;
• a plurality of conductive patterns formed from a conductive ink, each of the plurality of conductive patterns printed a respective sheet of the plurality of dielectric sheets;
• and
• a plurality of conductive materials, each of the plurality of conductive materials disposed over a through-hole of a respective sheet of the plurality of dielectric sheets and electrically connecting a conductive pattern of the respective sheet to one of a conductive pattern of an adjacent one of the plurality of dielectric sheets or to the TSV bump.