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US 2014/0191392 A1Published application
Post-Passivation Interconnect Structure and Methods for Forming the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Wei Tu, Yian-Liang Kuo, Wei-Lun Hsieh, Tsung-Fu Tsai
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Abstract
A method includes forming a polymer layer over a passivation layer, wherein the passivation layer further comprises a portion over a metal pad. The polymer layer is patterned to form an opening in the polymer layer, wherein exposed surfaces of the polymer layer have a first roughness. A surface treatment is performed to increase a roughness of the polymer layer to a second roughness greater than the first roughness. A metallic feature is formed over the exposed surface of the polymer layer.
Claims20
A method comprising:
- forming a polymer layer over a passivation layer, wherein the passivation layer further comprises a portion over a metal pad;
- patterning the polymer layer to form an opening in the polymer layer, wherein exposed surfaces of the polymer layer have a first roughness;
- performing a surface treatment to increase a roughness of the polymer layer to a second roughness greater than the first roughness;
- and
- forming a metallic feature over the exposed surface of the polymer layer.
2 more elements
A method comprising:
- forming a passivation layer over a metal pad;
- patterning the passivation layer to expose a portion of the metal pad;
- forming a first polymer layer over the passivation layer and the metal pad;
- patterning the first polymer layer to form an opening in the first polymer layer, wherein a portion of the metal pad is revealed through the opening;
- performing a surface treatment on exposed surfaces of the first polymer layer, wherein the surface treatment comprises sputtering;
- and
- forming a Post-Passivation Interconnect (PPI) over the exposed surfaces of the first polymer layer.
4 more elements
A device comprising:
- a passivation layer over a metal pad;
- a first polymer layer over the passivation layer;
- and
- a Post-Passivation Interconnect (PPI) over and contacting top surfaces of the first polymer layer, wherein the PPI comprises a first portion over the first polymer layer, and a second portion in the first polymer layer, and wherein a surface of the first polymer layer contacting the PPI has a roughness greater than about 20 nm.
1 more element
Dependencies are inferred from the claim text.