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US 2014/0191390 A1Published application
Metal Routing Architecture for Integrated Circuits
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChita Chuang, Yao-Chun Chuang, Chih-Hua Chen, Chen-Cheng Kuo, Chen-Shien Chen
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Abstract
A device includes a substrate, a metal pad over the substrate, and a metal trace electrically disconnected from the metal pad. The metal pad and the metal trace are level with each other. A passivation layer includes a portion overlapping an edge portion of the metal pad. A metal pillar is overlying the metal pad, and is electrically connected to the metal pad. The metal trace has a portion overlapped by the metal pillar.
Claims20
A device comprising:
- a substrate;
- a metal pad over the substrate;
- a first metal trace electrically disconnected from the metal pad, wherein the metal pad and the first metal trace are level with each other;
- a passivation layer comprising a portion overlapping an edge portion of the metal pad;
- and
- a metal pillar overlying the metal pad and electrically connected to the metal pad, wherein the first metal trace comprises a portion overlapped by the metal pillar.
3 more elements
A device comprising:
- a substrate;
- a metal pad over the substrate;
- a first metal trace disconnected from the metal pad, wherein the metal pad and the first metal trace are level with each other;
- a polymer layer comprising a portion overlapping an edge portion of the metal pad;
- a Under-Bump Metallurgy (UBM), wherein the first metal trace comprises a first portion overlapped by the UBM, and a second portion not overlapped by the UBM, and wherein the UBM comprises:
- a first portion overlying and contacting the metal pad, wherein the first portion of the UBM penetrates through the polymer layer;
- and
- a second portion overlying the polymer layer;
- a solder region overlying and electrically coupled to the UBM;
- and
- a second metal trace joined to the solder region, wherein the solder region is in contact with a bottom surface and sidewalls of the second metal trace.
8 more elements
A device comprising:
- a substrate;
- an aluminum-containing pad over the substrate;
- a first metal trace disconnected from the aluminum-containing pad, wherein the aluminum-containing pad and the first metal trace are level with each other;
- a passivation layer covering edge portions of the aluminum-containing pad;
- a polymer layer over the passivation layer and covering the edge portions of the aluminum-containing pad;
- a Under-Bump Metallurgy (UBM) comprising a first portion extending into the passivation layer and the polymer layer to contact the aluminum-containing pad, and a second portion overlapping the polymer layer;
- and
- a metal pillar over the UBM, wherein edges of the metal pillar are aligned to respective edges of the UBM, and wherein the first metal trace comprises a portion vertically aligned to a portion of the UBM and a portion of the metal pillar.
5 more elements
Dependencies are inferred from the claim text.