Integrated circuit package
AssigneeTexas Instruments Incorporated
InventorsHan Meng@Eugene Lee Lee, Anis Fauzi Abdul Aziz, Yien Sien Khoo
Life of this patent
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Abstract
An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected to the interposer. Also, a method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe.
Claims20
An integrated circuit (IC) package comprising:
- a bottom leadframe;
- an interposer mounted on said bottom leadframe;
- a flipchip die mounted on said interposer;
- and
- a top leadframe electrically connected to said interposer.
The IC package of claim 5 wherein said passive circuit device is electrically connected to said top leadframe.
An integrated circuit (IC) package comprising:
- a pad with a top surface and a bottom surface;
- an interposer comprising an interposer leadframe and having a top surface and a bottom surface, said interposer leadframe having a plurality of inner pad portions and a plurality of outer pad portions provided thereon, said outer pad portions being integrally connected to said inner pad portions, said bottom surface of said interposer being attached to said top surface of said pad,
- at least one field-effect transistor (FET) overlying and electrically connected to at least one of said outer pad portions of said patterned metal layer;
- a flipchip die having a first surface and an opposite second surface, said second surface having a plurality of solder bumps extending therefrom that are connected to said plurality of inner pad portions of said interposer leadframe;
- a top leadframe having a top surface and a bottom surface and having a plurality of lead portions with inner ends and outer ends, wherein at least one of said lead portions is connected at said inner end thereof to at least one of said outer pad portions of said interposer leadframe and wherein at least one of said lead portions is connected at said inner end thereof to said at least one FET;
- wherein said bottom leadframe is soldered to said top leadframe;
- at least one passive circuit device mounted on said top surface of said top leadframe and electrically connected to at least one of said lead portions of said top leadframe;
- and
- a mold compound covering said at least one passive circuit device and portions of said top and bottom leadframes and exposing outer portions of said lead portions and exposing a bottom surface of said pad.
A method of making an integrated circuit (IC) package comprising:
- electrically and physically attaching a die to an interposer leadframe;
- attaching the interposer leadframe to a bottom leadframe;
- attaching a first circuit component to the interposer leadframe;
- and
- attaching a top leadframe to the bottom leadframe.
Dependencies are inferred from the claim text.