Integrated circuit package
AssigneeFreescale Semiconductor, Inc.
InventorsRalf Reuter, Saverio Trotta
Life of this patent
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Abstract
An integrated circuit package comprising a substrate and at least one semiconductor die is described. A connection unit may provide electrical connections between the substrate and the semiconductor die. The connection unit may comprise a stack of conduction layers and isolation layers stacked atop each other. The stack may include a microstrip line or a coplanar waveguide. The microstrip line or the coplanar waveguide may be part of a balun, a power divider, or a directional coupler.
Claims14
An integrated circuit package comprising:
- a substrate,
- one or more semiconductor dies, and
- a connection unit configured to provide electrical connections between said substrate and said one or more semiconductor dies, wherein;
- said connection unit comprises
- a stack comprising
- one or more conduction layers and of one or more isolation layers stacked atop each other in an alternating manner,
- a first conduction layer comprising a microstrip conductive line, and
- a second conduction layer comprising a ground plane, wherein said microstrip conductive line and said ground plane form a microstrip line.
The package of claim 3, said coplanar conductive lines are at least partly surrounded by said ground plane.
Dependencies are inferred from the claim text.