Semiconductor package and fabrication method thereof

A semiconductor package, comprising:

• a substrate;
• a first semiconductor element disposed on the substrate and having a first conductive pad and a second conductive pad connected to the first conductive pad and grounded to the substrate;
• a conductive layer formed on the first semiconductor element and electrically connected to the first conductive pad;
• a second semiconductor element disposed on the conductive layer;
• and
• an encapsulant formed on the substrate and encapsulating the first and second semiconductor elements.

A fabrication method of a semiconductor package, comprising:

• providing a substrate;
• disposing on the substrate a first semiconductor element having a first conductive pad;
• grounding the first conductive pad and the substrate;
• forming on the first semiconductor element a conductive layer electrically connected to the first conductive pad;
• disposing a second semiconductor element on the conductive layer;
• and
• forming on the substrate an encapsulant encapsulating the first and second semiconductor elements.

A fabrication method of a semiconductor package, comprising:

• providing a substrate;
• disposing on the substrate a first semiconductor element having a first conductive pad and a second conductive pad connected to the first conductive pad;
• grounding the second conductive pad and the substrate;
• forming on the first semiconductor element a conductive layer electrically connected to the first conductive pad;
• disposing a second semiconductor element on the conductive layer;
• and
• forming on the substrate an encapsulant encapsulating the first and second semiconductor elements.