External storage device and method of manufacturing external storage device

An external storage device comprising:

• an interconnect substrate having a contact type external terminal;
• a first semiconductor chip disposed over a first surface of said interconnect substrate;
• a second semiconductor chip disposed over the first surface of said interconnect substrate;
• and
• a sealing resin layer which seals said first and second semiconductor chips and which does not cover said external terminal,
• wherein said first semiconductor chip and said second semiconductor chip are connected to each other,
• wherein said first semiconductor chip comprises a storage element,
• wherein said second semiconductor chip comprises an inductor being connected to said storage element, a driver circuit configured to control said inductor, and an interconnect layer,
• wherein said interconnect layer is formed at a first surface of said second semiconductor chip and includes said inductor,
• wherein said first surface of said second semiconductor chip is other than facing said first surface of said interconnect substrate, and
• wherein said inductor and said driver circuit are connected to each other through said interconnect layer.

An external storage device comprising:

• an interconnect substrate having a contact type external terminal;
• a semiconductor chip disposed over a first surface of said interconnect substrate;
• and
• a sealing resin layer which seals said semiconductor chip and does not cover said external terminal,
• wherein said semiconductor chip comprises:
• a storage device;
• an inductor connected to said storage device;
• and
• a driver circuit configured to control said inductor,
• wherein said inductor is formed in a layer of said semiconductor chip, and
• wherein said layer of said semiconductor chip is located at a surface of said semiconductor chip which is opposite a surface of said semiconductor chip which is disposed over said interconnect substrate.