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US 2014/0191362 A1Published application
Electroless plating of cobalt alloys for on chip inductors
AssigneeInternational Business Machines Corporation
InventorsWilliam J. Gallagher, Eugene J. O'Sullivan, Naigang Wang
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Abstract
A method for forming an on-chip magnetic structure includes forming a seed layer over a substrate of a semiconductor chip. The seed layer is patterned to provide a plating location. A cobalt based alloy is electrolessly plated at the plating location to form an inductive structure on the semiconductor chip.
Claims5
An on-chip magnetic structure, comprising:
- a patterned seed layer formed over a substrate of a semiconductor chip to provide a plating location;
- and
- a magnetic structure including an electrolessly plated cobalt based alloy formed at the plating location, the inductive structure including at least one of a yoke and a coil.
Dependencies are inferred from the claim text.