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US 2014/0191361 A1Published application
Electroless plating of cobalt alloys for on chip inductors
AssigneeInternational Business Machines Corporation
InventorsWilliam J. Gallagher, Eugene J. O'Sullivan, Naigang Wang
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Abstract
A method for forming an on-chip magnetic structure includes forming a seed layer over a substrate of a semiconductor chip. The seed layer is patterned to provide a plating location. A cobalt based alloy is electrolessly plated at the plating location to form an inductive structure on the semiconductor chip.
Claims21
A method for forming an on-chip magnetic structure, comprising:
- forming a seed layer from a material that displays magnetic properties over a substrate of a semiconductor chip;
- patterning the seed layer to provide a plating location;
- and
- electrolessly plating a cobalt based alloy at the plating location to form a magnetic structure on the semiconductor chip.
1 more element
A method for forming an on-chip magnetic structure, comprising:
- forming an adhesion layer over a substrate of a semiconductor chip;
- forming a seed layer on the adhesion layer;
- forming a protective layer over the seed layer;
- patterning the seed layer and the protective layer to provide a plating location;
- removing the protective layer;
- and
- electrolessly plating a cobalt or iron based alloy at the plating location to form a magnetic structure on the semiconductor chip.
4 more elements
-20. (canceled)
A method for forming an on-chip magnetic structure, comprising:
- forming a seed layer from a non-magnetic material over a substrate of a semiconductor chip;
- patterning the seed layer to provide a plating location;
- activating the seed layer by dipping the chip in an activating solution;
- and
- electrolessly plating a cobalt based alloy at the plating location to form a magnetic structure on the semiconductor chip.
2 more elements
Dependencies are inferred from the claim text.