Laser system with polarized oblique incidence angle and associated methods
AssigneeSiOnyx, Inc.
InventorChristopher Vineis
Life of this patent
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Abstract
Novel laser processed semiconductor materials, systems, and methods associated with the manufacture and use of such materials are provided. In one aspect, for example, a method of processing a semiconductor material can include providing a semiconductor material and irradiating a target region of the semiconductor material with a beam of laser radiation to form a laser treated region. The laser radiation is irradiated at an angle of incidence relative to the semiconductor material surface normal of from about 5° to about 89°, and the laser radiation can be at least substantially p-polarized.
Claims21
A method of processing a semiconductor material, comprising:
- providing a semiconductor material;
- irradiating a target region of the semiconductor material with a beam of laser radiation to form a laser treated region, wherein the laser radiation is irradiated at an angle of incidence relative to the semiconductor material surface normal of from about 5° to about 89°, and wherein the laser radiation is substantially p-polarized.
A light enhanced semiconductor material, comprising:
- a semiconductor material;
- a laser treated region on a surface of the semiconductor material, the laser treated region having surface features oriented at an angle of incidence relative to the semiconductor material surface normal of from about 5° to about 89°.
Dependencies are inferred from the claim text.