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US 2014/0191350 A1Published application
Image sensor chip package and fabricating method thereof
AssigneeXintec Inc.
InventorsChih-Hao CHEN, Bai-Yao LOU, Shih-Kuang CHEN
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Abstract
An image sensor chip package is disclosed, which includes a substrate, an image sensor component formed on the substrate, a spacer formed on the substrate and surrounding the image sensor component, and a transparent plate. A stress notch is formed on a side of the transparent plate, and a breaking surface is extended from the stress notch. A method for fabricating the image sensor chip package is also disclosed.
Claims24
An image sensor chip package, comprising:
- a substrate;
- an image sensor component formed on the substrate;
- a spacer formed on the substrate and surrounding the image sensor component;
- and
- a transparent plate disposed on the spacer, wherein the transparent plate comprises a stress notch and a breaking surface extended from the stress notch.
2 more elements
A method for fabricating an image sensor chip package, comprising:
- providing a wafer;
- cutting a substrate of the wafer;
- forming a plurality of stress notches on a surface of a transparent plate of the wafer;
- and
- pressing the transparent plate, wherein the transparent plate is broken along the stress notches, and the wafer is divided into a plurality of image sensor chip packages.
2 more elements
Dependencies are inferred from the claim text.