Solid-state imaging device

A solid-state imaging device comprising:

• a semiconductor substrate including a pixel area and a peripheral circuit area and having a first principal surface and a second principal surface;
• an interconnection structure provided on the first principal surface of the semiconductor substrate and including first interconnection layers electrically connected to the peripheral circuit area;
• a second interconnection layer provided in the peripheral circuit area and on the second principal surface of the semiconductor substrate;
• a third interconnection layer provided above the second interconnection layer with an insulating layer therebetween;
• and
• through electrodes electrically connecting the second interconnection layer to the third interconnection layer and passing through the semiconductor substrate.