Semiconductor device and method of manufacturing the same
AssigneeThe Institute of Microelectronics Chinese Academy of Science
InventorsHuaxiang Yin, Changliang Qin, Xiaolong Ma, Qiuxia Xu, Dapeng Chen
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AssigneeThe Institute of Microelectronics Chinese Academy of Science
InventorsHuaxiang Yin, Changliang Qin, Xiaolong Ma, Qiuxia Xu, Dapeng Chen
Estimating the term…
The present invention discloses a semiconductor device, comprising a plurality of fins located on a substrate and extending along a first direction; a plurality of gate stack structures extending along a second direction and across each of the fins; a plurality of stress layers located in the fins on both sides of the gate stack structures and having a plurality of source and drain regions therein; a plurality of channel regions located in the fins below the gate stack structures; characterized in that the stress layers have connected parts in the fins and that the channel regions enclose the connected parts.
A semiconductor device, comprising:
A method of manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.