Stacked power semiconductor device using dual lead frame

A stacked power semiconductor device with dual lead frame, comprising:

• a bottom lead frame comprising a first bottom base, a second and a third bottom bases adjacent to the first bottom base and separated from the first bottom base;
• a mounting clip comprising an extending part bending downward;
• a top lead frame comprising a first top base and a second top base adjacent to and separated from the first top base;
• a first semiconductor chip comprising a first electrode and a second electrode at a front side of the first semiconductor chip and a third electrode at a back side of the first semiconductor chip;
• and
• a second semiconductor chip comprising a first electrode and a second electrode at a front side of the second semiconductor chip and a third electrode at a back side of the second semiconductor chip;
• wherein the first semiconductor chip is flip-chip mounted on the bottom lead frame with the first and second electrodes respectively connected to the first bottom base and the second bottom base of the bottom lead frame, wherein the mounting clip is stacked on the first semiconductor chip with a bottom surface of the mounting clip connected to the third electrode located on the back side of the first semiconductor chip, with the downward extending part of the mounting clip extending to and connecting to a top surface of the third bottom base of the bottom lead frame, and
• wherein the second semiconductor chip is flip-chip mounted on a top surface of the mounting clip with the first electrode connected to the mounting clip and the second electrode extending beyond an edge of the mounting clip, wherein a bonding wire electrically connecting the second electrode of the second semiconductor chip to a bottom surface of the second top base of the top lead frame facing against the third electrode of the first semiconductor chip, wherein the first top base of the top lead frame is stacked on and electrically connected to the third electrode of the second semiconductor chip.