Power semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsSyotaro ONO, Masaru IZUMISAWA, Hiroshi OHTA, Hiroaki YAMASHITA
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AssigneeKabushiki Kaisha Toshiba
InventorsSyotaro ONO, Masaru IZUMISAWA, Hiroshi OHTA, Hiroaki YAMASHITA
Estimating the term…
A power semiconductor device according to an embodiment includes an element portion in which MOSFET elements are provided and a termination portion provided around the element portion, and has pillar layers provided respectively in parallel to each other in a semiconductor substrate. The device includes a first trench and a first insulation film. The first trench is provided between end portions of the pillar layers, in the semiconductor substrate at the termination portion exposed from a source electrode of the MOSFET elements. The first insulation film is provided on a side surface and a bottom surface of the first trench.
A power semiconductor device including an element portion, and a termination portion provided around the element portion, the power semiconductor device comprising:
Dependencies are inferred from the claim text.