Substrate, Semiconductor Construction, and Manufacturing Method Thereof
AssigneeUnistars Corporation
InventorsTien-Hao Huang, Hsin-Hsie Lee, Yi-Chun Wu, Shang-Yi Wu
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Abstract
A substrate includes a die-bonding zone and a glue spreading pattern. The die-bonding zone is set to bond a die. The glue spreading pattern is placed in the die-bonding zone and includes a containing space. The die is placed on the glue spreading pattern, an area of a bottom of the die is greater than an area of an opening of the glue spreading pattern, the containing room of the glue spreading pattern is filled with a glue, and the die is bonded to the substrate by means of the glue.
Claims21
A substrate, comprising:
- a die-bonding zone for bonding a die, with the die comprising a plurality of laterals;
- a glue spreading pattern disposed in the die-bonding zone, and the die disposed above the glue spreading pattern;
- and
- a glue disposed in the die-bonding zone to bond the die onto the die-bonding zone, wherein the glue is bonded between a bottom of the die and the glue spreading pattern;
- wherein the glue spreading pattern is configured to make the glue spread on the back of the die and prevent the glue overflowing to the laterals of the die.
A semiconductor construction comprising:
- a substrate, comprising:
- a die-bonding zone to bond a die, with the die comprising a plurality of laterals;
- a glue spreading pattern disposed in the die-bonding zone, and the die disposed above the glue spreading pattern;
- and
- a glue disposed in the die-bonding zone to bond the die onto the die-bonding zone, wherein the glue is dispensed between a bottom of the die and the glue spreading pattern, and the glue spreading pattern is configured to make the glue spread on the back of the die and prevent the glue overflowing to the laterals of the die;
- and
- a transparent glue placed in the die-bonding zone to cover the die and guide the light emitted from the die.
A manufacturing method for a semiconductor construction, comprising:
- (a) providing a substrate;
- (b) disposing a die-bonding zone in the substrate to bond a die;
- (c) disposing a glue spreading pattern in the die-bonding zone;
- (d) disposing a glue in the die-bonding zone;
- and
- (e) placing the die on the die-bonding zone of the substrate and pressing the die so as to bond the die on the substrate by means of the glue;
- wherein in step (e), the glue flows along the glue spreading pattern so as to spread on the back of the die instead of the laterals of the die.
Dependencies are inferred from the claim text.