Compositions for an led reflector and articles thereof

A resin composition for molding a reflector for a light-emitting semiconductor diode reflector comprising, the resin composition comprising:

• about 30 to about 70 wt. % poly(1,4-cyclohexanedimethylene terephthalate);
• about 10 to 30 wt. % of titanium dioxide;
• and
• about 10 to 30 wt. % of a glass fibers having a flat surface and an aspect ratio in cross-section, of 1:1 to 4.5:1;
• and
• 0.1 and 10 wt. % of one or more additives selected from the group consisting of mold release agents, antioxidants, quenchers, light stabilizers, nucleating agents and combinations thereof.

A light-emitting semiconductor package comprising a reflector and a solder, wherein the reflector comprises a resin composition comprising:

• about 25 to about 80 wt. % of heat-resistant aromatic polyester have a melting point temperature higher than the point of the solder of which
• at least about 80 mole percent of diol repeat units, derivable from 1,4-cyclohexanedimethanol, are of formula (I):
• and at least about 80 mole percent of dicarboxylic acid repeat units, derivable from terephthalic acid, are of formula (II):
• about 5 to 50 wt. % of titanium dioxide filler;
• and
• about 5 to 50 wt. % of glass fiber having a flat surface.

A resin composition for molding a reflector for a light-emitting semiconductor unit comprising:

• about 25 to about 80 wt. % of an organic resin having a melting point or transition glass temperature of at least 260° C., wherein the organic resin is poly(1,4-cyclohexanedimethylene terephthalate);
• about 5 to 50 wt. % of white titanium dioxide filler;
• and
• about 5 to 50 wt. % of glass fiber having a flat surface.