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US 2014/0191155 A1Published application
Composition and method for polishing polysilicon
OwnerBrian REISS, Timothy JOHNS +3inventors
InventorsBrian REISS, Timothy JOHNS, Michael WHITE, Lamon JONES, John CLARK
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Abstract
The invention provides a polishing composition comprising silica, an aminophosphonic acid, a polysaccharide, a tetraalkylammonium salt, a bicarbonate salt, an azole ring, and water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.
Claims9
A chemical-mechanical polishing composition consisting essentially of:
- (a) about 0.5 wt. % to about 20 wt. % of silica,
- (b) about 0.005 wt % to about 2 wt. % of one or more aminophosphonic acids,
- (c) about 0.001 wt. % to about 0.1 wt. % of one or more polysaccharides,
- (d) about 0.05 wt. % to about 5 wt. % of one or more tetraalkylammonium salts,
- (e) about 0.01 wt. % to about 2 wt. % of a bicarbonate salt,
- (f) about 0.005 wt. % to about 2 wt. % of one or more compounds comprising an azole ring,
- (g) optionally potassium hydroxide, and
- (h) water,
- wherein the polishing composition has a pH of about 7 to about 11.
6 more elements
Dependencies are inferred from the claim text.