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US 2014/0190946 A1Published application
Laser Microdissection Method and Laser Microdissection Device
AssigneeCarl Zeiss Microscopy GmbH
InventorMichael Gögler
Life of this patent
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Abstract
Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter.
Claims19
A method for laser microdissection, comprising:
- adjusting at least one first system parameter of a laser microdissection system, and
- automatically adjusting at least one second system parameter of the laser microdissection system depending on the at least one first system parameter such that a desired value of a cut line parameter describing a cut line of the laser microdissection is present.
A laser microdissection system, comprising:
- a laser device,
- a receiving device for a sample to be treated, and
- a control device, wherein the control device is configured to enable an adjusting of at least one first system parameter of the laser microdissection system and further to automatically adjust at least one second system parameter of the laser microdissection system depending on the at least one first system parameter such that a desired value of a cut line parameter describing a cut line of the laser microdissection system is obtained.
Dependencies are inferred from the claim text.