System and Method for Cleaning Semiconductor Fabrication Equipment Parts
AssigneeQuantum Global Technologies, LLC
InventorSamantha Tan
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Abstract
An exemplary embodiment discloses a process for cleaning semiconductor fabrication equipment parts with non-metallic surfaces. The process optionally includes providing a semiconductor fabrication part with a non-metallic surface to be cleaned and applying a dilute aqueous solution to remove contamination from the non-metallic surface. The aqueous solution optionally includes dilute amounts of hydrofluoric acid, nitric acid and hydrogen peroxide. The dilute amounts would optionally be in the ranges of 0.5-1.5% wt. hydrofluoric acid, 0.1-0.5% wt. nitric acid and 1-10% wt. hydrogen peroxide.
Claims1
A method for removing particles on a textured surface of a semiconductor fabrication equipment part comprising:
- determining a chemical bonding characteristic of the particles;
- identifying a type of particles embedded in the textured surface;
- measuring a depth of any subsurface damage;
- and performing a combination of ultrasonication and chemical etching to the textured surface based upon said chemical bonding characteristics, said type of particles and said depth of subsurface damage.
Dependencies are inferred from the claim text.