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US 2014/0190936 A1Published application
Etching apparatus for substrate and method of etching using the same
AssigneeSamsung Display Co., Ltd.
InventorsHae-Young YOO, Pyoung-Kyu PARK, Woo-Youl PARK, Min-Kyu SHIN, Jung-Kun SHIN
Life of this patent
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Abstract
An etching apparatus includes a receiving container which receives a substrate, and a first spraying unit which supplies etchant into the receiving container. The receiving container includes a bottom plate, a plurality of bottom through holes defined in the bottom plate and through which the etchant is drained from the receiving container; and a plurality of side walls extended from the bottom plate.
Claims20
An etching apparatus comprising:
- a receiving container which receives a substrate and comprises:
- a bottom plate, and a plurality of bottom through holes defined in the bottom plate and through which an etchant is drained from the receiving container;
- and
- a plurality of side walls extended from the bottom plate;
- and
- a first spraying unit which supplies the etchant into the receiving container.
3 more elements
An etching apparatus comprising:
- a receiving container which receives a substrate and comprises:
- a bottom plate, and a plurality of bottom through holes defined in the bottom plate and through which an etchant is drained from the receiving container;
- and
- a plurality of side walls extended from the bottom plate;
- a first inside wall inside the side walls, and a plurality of side through holes defined in a lower portion of the first inside wall and through which the etchant is supplied to the receiving container;
- a second inside wall inside the side walls and facing the first inside wall, and the plurality of side through holes defined in a lower portion of the second inside wall and through which the etchant is supplied to the receiving container;
- a first spraying unit which supplies the etchant into the receiving container;
- and
- a second spraying unit which is adjacent to the first spraying unit, faces a side wall of the receiving container and supplies the etchant into the receiving container.
6 more elements
A method of etching a substrate using an etching apparatus, the method comprising:
- moving an opening and closing driving part of the etching apparatus upward to close bottom through holes defined in a bottom plate of a receiving container of the etching apparatus and through which an etchant is drained from the receiving container;
- supplying the etchant to the receiving container in a closed state of the bottom through holes to fill the receiving container with the etchant at a predetermined level;
- moving the opening and closing driving part downward to open the bottom through holes defined in the bottom plate and drain the etchant from the receiving container;
- supplying the etchant to the receiving container in an open state of the bottom through holes to maintain a level of the etchant at a constant level in the receiving container;
- and
- stopping the supplying the etchant to the receiving container and the draining the etchant from the receiving container,
- wherein the etching apparatus comprises:
- the receiving container comprising the bottom plate, the bottom through holes defined in the bottom plate, and a plurality of side walls;
- and
- the opening and closing driving part comprising a plurality of protruding portions configured to be inserted into the bottom through holes defined in the bottom plate.
7 more elements
Dependencies are inferred from the claim text.