US 2014/0190931 A1 · REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES

Abstract

A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

Claims29

Dependent claims

A method for selectively applying a protective coating to a substrate, comprising:

applying a protective coating to a substrate;
and
selectively removing at least one selected portion of the protective coating from at least one selected component or feature of the substrate to expose the at least one selected component or feature through the protective coating.

Dependencies are inferred from the claim text.

Facts

Application

14/157,743Filed 17 Jan 2014

Priority

8 Jan 2013

Published

10 Jul 2014

Term ends

Not estimatedThe source records don’t support an estimate.

Classification40 codes

B23K 26/362
Removing material: laser etching
B05D 1/322
Using means for protecting parts of a surface not to be coated, e.g. using stencils, resists: removable films used as masks
B23K 26/0622
By direct control of the laser beam: by shaping pulses
B23K 26/082
Devices involving relative movement between laser beam and workpiece: scanning systems, i.e. devices involving movement of the laser beam relative…

Removal of selected portions of protective coatings from substrates

Life of this patent

Removal of selected portions of protective coatings from substrates

Life of this patent

Abstract

Claims29