Plating apparatus, nozzle-anode unit, method of manufacturing plated member, and fixing apparatus for member to be plated
AssigneeYuken Industry Co., Ltd.
InventorsNorikazu KOJIMA, Yoshiharu KIKUCHI
Life of this patent
Estimating the term…
Loading patent…
AssigneeYuken Industry Co., Ltd.
InventorsNorikazu KOJIMA, Yoshiharu KIKUCHI
Estimating the term…
A plating apparatus includes a plating bath, an insoluble anode located in the plating bath, a plating electric power supply being capable of applying a voltage between the insoluble anode and the member to be plated, an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath, and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism.
A plating apparatus comprising:
A method of manufacturing a plated member, comprising:
A nozzle-anode unit comprising a plating solution-ejecting portion and an insoluble anode,
A fixing apparatus for fixing a member to be plated comprising two hollow portions, each of the two hollow portions having at least one aperture, the fixing apparatus comprising:
Dependencies are inferred from the claim text.