Plating process

Abstract

A plated component and a plating process are disclosed. The plating process includes applying a material to a region of a component, the material being selected from the group consisting of nickel, cobalt, chromium, iron, aluminum, or a combination thereof. The region includes a single crystal microstructure, includes a directionally solidified microstructure, is substantially devoid of equiaxed microstructure, or a combination thereof. The applying includes electroplating, electroless plating, or the electroplating and the electroless plating. The plated component includes an electroplated region, an intermediate layer on the electroplated region, and an overlay coating on the intermediate layer.

Dependencies are inferred from the claim text.