Moisture barrier layer dielectric for thermoformable circuits
AssigneeE. I. Du Pont de Nemours and Company
InventorJAY ROBERT DORFMAN
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Abstract
This invention is directed to a polymer thick film moisture barrier layer dielectric composition comprising thermoplastic urethane resin, thermoplastic phenoxy resin, diacetone alcohol and fumed silica. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver above it and the polycarbonate substrate below it in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.
Claims15
A polymer thick film barrier layer dielectric composition comprising:
- (a) a first organic medium comprising 10-50 wt % thermoplastic urethane resin dissolved in an organic solvent, wherein the weight percent is based on the total weight of said first organic medium;
- (b) a second organic medium comprising 10-50 wt % thermoplastic phenoxy resin in an organic solvent wherein the weight percent is based on the total weight of said second organic medium;
- (c) 1-20 wt % diacetone alcohol, wherein the weight percent is based on the total weight of the composition;
- and
- (d) 0.1-5.0 wt % fumed silica, wherein the weight percent is based on the total weight of the composition.
A polymer thick film moisture barrier layer dielectric composition comprising:
- (a) thermoplastic urethane resin:
- (b) thermoplastic phenoxy resin;
- (c) diacetone alcohol;
- and
- (d) fumed silica.
Dependencies are inferred from the claim text.