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AssigneeNEC Corporation
InventorsHitoshi Sakamoto, Minoru Yoshikawa, Masaki Chiba, Kenichi Inaba, Arihiro Matsunaga
Estimating the term…
An electronic substrate 100D has a tabular base material 110 which can install a heater element 120 and the cooling structure that cools the heater element 120. An electronic substrate 100 can be plugged in/out in the case 200 in the direction which is almost parallel to the face of the base material 110. The cooling structure is installed on the tabular base material 110, and has the first heat radiation part 160D with a hollow shape and the heat transfer part 700. The first heat radiation part 160D with a hollow shape radiates the generated heat of the heater element 120 installed in the base material. The heat transfer part 700 transfers the generated heat of the heater element 120 to the first heat radiation part 160D. The first heat radiation part 160D has the first joint surface 165 formed along a face which is almost vertical to the insert and removal direction W of the base material 110. The first heat radiation part 160D is connected to the second radiation part 260B set up in the case 200 thermally through the first joint surface 165. As a result, the generated heat of the heater element can be radiated sufficiently.
An electronic substrate including a tabular base material which can install a heater element and a cooling structure which cools the generated heat of the heater element, in which the base material is possible to be plugged in and out in a case to the direction which is almost parallel to the surface of the base material,
An electronic apparatus including an electronic substrate and a case which accommodates the electronic substrate,
Dependencies are inferred from the claim text.