Back to results
US 2014/0190672 A1Published application
Thermal Interface Materials
AssigneeCabot Corporation
InventorsSrinivas H. Swaroop, Timothy D. Davis, Andrea O. Barney
Life of this patent
Estimating the term…
Abstract
The present invention relates to thermal interface materials comprising a filler dispersed in a polymer, wherein the filler has an average aggregate particle size of less than or equal to 1 micron. Preferably the filler is a synthetic alumina, such as fumed alumina.
Claims21
1-25. (canceled)
A thermal interface material comprising:
- at least 27.65% by weight of either an epoxy polymer, a polysiloxane polymer, or both;
- and
- a modified fumed alumina dispersed in the polymer, the modified fumed alumina having attached at least one organic group, the modified fumed alumina having an average aggregate particle size of less than or equal to 1 micron and a surface area of greater than or equal to about 30 m2/g.
An electronic component system comprising:
- a heat generating component;
- a heat dissipating component;
- and
- a thermal interface material disposed between the heat generating component and the heat dissipating component, the thermal interface material comprising:
- a modified fumed alumina having an average aggregate particle size of less than or equal to 1 micron and a surface area of greater than or equal to about 30 m2/g;
- and
- a polymer selected from epoxy resins, polysiloxane resins or a combination thereof.
4 more elements
A method comprising:
- dispersing greater than 10% by weight of a modified fumed alumina in a resin system to produce a dispersion, the modified fumed alumina having an aggregate particle size of less than one micron, and the resin system comprising at least one of an epoxy resin and a polysiloxane resin;
- disposing the dispersion between a heat generating component and a heat dissipating component;
- and
- crosslinking the resin system.
1 more element
Dependencies are inferred from the claim text.