Cooling head and electronic apparatus
AssigneeFujitsu Limited
InventorsYuki HOSHINO, Kenji FUKUZONO
Life of this patent
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Abstract
A cooling head includes: a first refrigerant flow channel, provided so as to be in contact with an object to be cooled, configured to flow refrigerant; a second refrigerant flow channel configured to flow the refrigerant; and at least one communication hole, provided between both ends of the object to be cooled in the first refrigerant flow channel in a first flow direction of refrigerant in the first refrigerant flow channel, configured to allow the first refrigerant flow channel and the second refrigerant flow channel to communicate with each other.
Claims20
A cooling head comprising:
- a first refrigerant flow channel, provided so as to be in contact with an object to be cooled, configured to flow refrigerant;
- a second refrigerant flow channel configured to flow the refrigerant;
- and
- at least one communication hole, provided between both ends of the object to be cooled in the first refrigerant flow channel in a first flow direction of refrigerant in the first refrigerant flow channel, configured to allow the first refrigerant flow channel and the second refrigerant flow channel to communicate with each other.
An electronic apparatus comprising:
- an electronic device;
- and
- a cooling head configured to cool the electronic device, wherein the cooling head includes:
- a first refrigerant flow channel, provided so as to be in contact with an object to be cooled, configured to flow refrigerant;
- a second refrigerant flow channel configured to flow the refrigerant;
- and
- at least one communication hole, provided between both ends of the object to be cooled in the first refrigerant flow channel in a first flow direction of refrigerant in the first refrigerant flow channel, configured to allow the first refrigerant flow channel and the second refrigerant flow channel to communicate with each other.
Dependencies are inferred from the claim text.