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US 2014/0190635 A1Published application
Plasma chamber and apparatus for treating substrate
AssigneesIndustry-University Cooperation Foundation Hanyang University, Psk Inc.
InventorsJong Sik LEE, Jeonghee CHO, Hyun Jun KIM, Chin Wook CHUNG, Duksun HAN
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Abstract
Provided are a plasma chamber and a substrate treating apparatus. The plasma chamber includes a housing in which a gas is injected to generate plasma, a first coil disposed on one surface of the housing, and a second coil disposed on the other surface of the housing.
Claims25
A plasma chamber comprising:
- a housing in which a gas is injected to generate plasma;
- a first coil disposed on one surface of the housing;
- and
- a second coil disposed on the other surface of the housing.
1 more element
A substrate treating apparatus comprising:
- a process unit providing a space in which a substrate is disposed to plasma-treat the substrate;
- and
- a plasma generation unit generating plasma from a gas to supply the generated plasma into the process unit,
- wherein the plasma generation unit comprises:
- an RF power source for providing an RF signal
- a housing in which a gas is injected to generate plasma;
- a first coil disposed on one surface of the housing, the first coil receiving the RF signal to induce electromagnetic fields in the housing;
- and
- a second coil disposed on the other surface of the housing, the second coil receiving the RF signal to induce electromagnetic fields in the housing.
6 more elements
Dependencies are inferred from the claim text.