Copper alloy and method of manufacturing copper alloy

Abstract

Disclosed is a beryllium-free copper alloy having high strength, high electric conductivity and good bending workability and a method of manufacturing the copper alloy. Provided is a copper alloy having a composition represented by the composition formula by atom %: Cu100-a-b-c(Zr, Hf)a(Cr, Ni, Mn, Ta)b(Ti, Al)c [wherein 2.5≦a≦4.0, 0.1<b≦1.5 and 0≦c≦0.2; (Zr, Hf) means one or both of Zr and Hf; (Cr, Ni, Mn, Ta) means one or more of Cr, Ni, Mn and Ta; and (Ti, Al) means one or both of Ti and Al], and having Cu primary phases in which the mean secondary dendrite arm spacing is 2 μm or less and eutectic matrices in which the lamellar spacing between a metastable Cu5(Zr, Hf) compound phase and a Cu phase is 0.2 μm or less.

Dependencies are inferred from the claim text.