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US 2014/0190565 A1Published application
Polymer/inorganic multi-layer encapsulation film
AssigneeResearch & Business Foundation Sungkyunkwan University
InventorsDong Geun JUNG, Heeyeop CHAE, Min Woo PARK, Hoon Bae KIM, Chae Min LEE
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Abstract
This invention relates to a polymer/inorganic multi-layer encapsulation film, and more particularly, to a multi-layer encapsulation film, which includes a plasma polymer thin film layer formed using a cross-shaped precursor having Si—O bonding and an inorganic thin film layer, and ensures flexibility and has improved encapsulation.
Claims15
A multi-layer encapsulation film, comprising:
- a plasma polymer thin film layer formed by using a precursor represented by Chemical Formula 1 below;
- and
- an inorganic thin film layer:
- wherein R1 to R12 are each independently H or C1-C5 alkyl.
1 more element
A method of manufacturing a multi-layer encapsulation film, comprising:
- 1) depositing a plasma polymer thin film layer using a precursor represented by Chemical Formula 1 below;
- and
- 2) depositing an inorganic thin film layer using an inorganic precursor:
- wherein R1 to R12 are each independently H or C1-C5 alkyl.
1 more element
Dependencies are inferred from the claim text.