Apparatus and method for treating substrate
AssigneePsk Inc.
InventorsJongjin Lee, Bum Joon Park, Tae Hoon Kim, Chang Weon Lee, Sunwoong Yim, Han Kyu Lee
Life of this patent
Estimating the term…
Abstract
Provided is a substrate treatment apparatus. The substrate treatment apparatus includes a load port on which a carrier accommodating a plurality of substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed, a plasma treatment unit supplying plasma to treat a top surface of the wafer, and a substrate transfer unit transferring the substrate between the carrier and the plasma treatment unit.
Claims28
A substrate treatment apparatus comprising:
- a load port on which a carrier accommodating a plurality of substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed;
- a plasma treatment unit supplying plasma to treat a top surface of the wafer;
- and
- a substrate transfer unit transferring the substrate between the carrier and the plasma treatment unit.
A substrate treatment apparatus comprising:
- a process chamber having an inner space;
- a susceptor disposed within the process chamber and on which a substrate to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed;
- a plasma supply part supplying a plasma gas into the process chamber;
- a blocking ring covering the mounting tape exposed to the outside in a region of the substrate placed on the susceptor;
- and
- an elevation member elevating the blocking ring.
A substrate treatment method comprising:
- transferring a substrate, to which a back-ground wafer is attached to a mounting tape fixed to a frame ring, into a process chamber;
- seating the substrate on a susceptor disposed within the process chamber;
- and
- supplying plasma into the process chamber to treat a top surface of the wafer.
An apparatus for treating a substrate to which a back-ground wafer is attached to a mounting tape fixed to a frame ring, the apparatus comprising:
- a transfer robot comprising a hand part grasping a portion of the frame ring in a tong manner, the transfer robot transferring the substrate.
A method for treating substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring, the method comprising:
- allowing a hand part of a transfer robot to pick-up one of the substrates from a carrier in which the substrates are stacked,
- wherein the hand part grasps a portion of the frame ring in a tong manner to pick-up the substrates.
Dependencies are inferred from the claim text.