Device and method for forming film
AssigneeTokyo Electron Limited
InventorsKenji MATSUMOTO, Hidenori MIYOSHI
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Abstract
The present disclosure relates to a film forming apparatus for forming a thin film on a surface of an object to be processed by using an organic metal raw material gas within a processing chamber configured to exhaust air, wherein a hydrophobic layer is installed on a surface of a member exposed to the atmosphere within the processing chamber.
Claims10
1-12. (canceled)
A film forming apparatus for forming a thin film on a surface of an object to be processed by using an organic metal raw material gas within a processing chamber configured to exhaust air,
- wherein a hydrophobic layer is installed on a surface of a member exposed to the atmosphere within the processing chamber.
A film forming apparatus for forming a thin film on a surface of an object to be processed by using an organic metal raw material gas and an oxygen-containing gas within a processing chamber configured to exhaust air,
- wherein a hydrophobic layer is installed on a surface of a member exposed to the atmosphere within the processing chamber.
Dependencies are inferred from the claim text.