Method for Bonding Substrates

Abstract

The method for bonding a first substrate to a second substrate includes dispensing a paste directly onto a first substrate, the paste including a glass powder, a thermoplastic, and a first solvent, evaporating the first solvent to form a thickened paste, placing a second substrate on the thickened paste to form a stack, applying to the stack a force sufficient to cause deformation of the thickened paste, and heating the stack to a bonding temperature above a glass transition temperature of the glass powder so as to cause removal of the thermoplastic from the thickened paste and to form a glass joint between the first and second substrates.

Dependencies are inferred from the claim text.