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US 2014/0179832 A1Published application
Epoxy resin composition for encapsulating a semiconductor device and semiconductor device encapsulated using the same
OwnerKyoung Chul BAEinventor
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Abstract
The present invention provides an epoxy resin composition for encapsulating a semiconductor device, comprising: an epoxy resin, a curing agent, a curing accelerator, a coupling agent, and an inorganic filler, wherein the coupling agent comprises an alkylsilane compound represented by Formula 1: wherein R1, R2 and R3 are each independently a C1 to C4 alkyl group, R is a C6 to C31 alkyl group, and n ranges from about 1 to 5 on average.
Claims16
An epoxy resin composition for encapsulating a semiconductor device, the composition comprising:
- an epoxy resin;
- a curing agent;
- a curing accelerator;
- a coupling agent;
- and
- an inorganic filler,
- wherein the coupling agent includes an alkylsilane compound represented by Formula 1:
- and
- wherein R1, R2, and R3 are each independently a C1 to C4 alkyl group, R is a C6 to C31 alkyl group, and n is about 1 to about 5 on average.
6 more elements
Dependencies are inferred from the claim text.