Positive Photosensitive Resin Composition, and Organic Insulator Film for Display Device and Display Device Fabricated Using the Same

A positive photosensitive resin composition, comprising:

• (A) at least one dissolution controlling agent comprising a compound including a repeating unit represented by the following Chemical Formula 1, a compound including a repeating unit represented by the following Chemical Formula 2, or a combination thereof;
• (B) a polybenzoxazole precursor;
• (C) a photosensitive diazoquinone compound;
• and
• (D) a solvent,
• wherein the dissolution controlling agent (A) is included in an amount of about 5 to about 35 parts by weight based on about 100 parts by weight of the polybenzoxazole precursor (B):
• wherein, in Chemical Formulae 1 and 2,
• R1, R5, R6, R7, R12 and R′ are the same or different and are each independently hydrogen, substituted or unsubstituted C1 to C20 alkyl, or substituted or unsubstituted C1 to C20 fluoroalkyl,
• R2 and R8 are the same or different and are each independently —CO—, —COO—, —OCO—, —OCO—COO—, or substituted or unsubstituted C1 to C20 alkylene,
• R3, R10 and R11 are the same or different and are each independently hydrogen, substituted or unsubstituted C1 to C20 alkyl, substituted or unsubstituted C2 to C20 alkenyl, substituted or unsubstituted C2 to C20 alkynyl, substituted or unsubstituted C3 to C20 cycloalkyl, substituted or unsubstituted C3 to C20 cycloalkenyl, substituted or unsubstituted C3 to C20 cycloalkynyl, or substituted or unsubstituted C6 to C30 aryl,
• R4 is substituted or unsubstituted C1 to C20 fluoroalkyl, and
• R9 is substituted or unsubstituted C1 to C20 fluoroalkylene.