Photosensitive resin composition
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsDai Shiota, Mayumi Kuroko, Tatsuro Ishikawa
Life of this patent
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Abstract
A photosensitive resin composition having excellent storage stability which can form a high precision pattern upon a low amount of exposure; a method of forming a pattern including a polysiloxane coating with the photosensitive resin composition; and an electronic component including a pattern including a polysiloxane coating formed with the photosensitive resin composition. A compound which generates an imidazole compound having a predetermined structure by light is added to a photosensitive resin composition including one or more hydrolyzable silane compounds, hydrolysates of the hydrolyzable silane compounds and condensates thereof and a photo-base generator or a photo-acid generator.
Claims7
A photosensitive resin composition comprising:
- (A) one or more selected from the group consisting of hydrolyzable silane compounds represented by the following general formula:
- RnSiX4-n (1)
- wherein, in the general formula (1), R represents a hydrogen atom or an organic group having 1 to 20 carbon atoms, X represents a hydrolyzable group and n is an integer of 0 to 2,
- hydrolysates of the hydrolyzable silane compounds and condensates thereof;
- (B) a photo-base generator or a photo-acid generator;
- and
- (C) a compound which generates an imidazole compound represented by the following general formula by light:
- wherein, in the general formula (c1), R1, R2 and R3 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphonato group, or an organic group.
Dependencies are inferred from the claim text.