Methods and Systems for Reducing Particles During Physical Vapor Deposition

Abstract

Embodiments provided herein describe methods and systems for depositing material onto a surface. A target including a material in a porous state is provided. The density of the material in the porous state is less than 93% of the absolute density of the material. The target is positioned over a surface. At least some of the material is caused to be ejected from the target and deposited onto the surface. Films deposited from the porous targets exhibit significantly fewer particle defects than films of the same material deposited from the conventionally preferred higher-density targets. Brittle materials, such as alloys of refractory metals and silicon, seem to particularly benefit. The larger, less-uniform layered grains of the porous targets seem less prone to 10-micron-scale delamination than the smaller, more uniform grains of denser targets.

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