Heat dissipation device
AssigneeAsia Vital Components Co., Ltd.
InventorChih-Yeh Lin
Life of this patent
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Abstract
A heat dissipation device includes a first board body and a second board body. The first board body has a first face and a second face. The second face is formed with a rough structure. The second board body has a third face and a fourth face. The fourth face is mated with the second face and covered by the second face. The second and fourth faces together define a chamber. A working fluid is filled in the chamber. The rough structure is coated with a coating. By means of the rough structure and the coating, the cost for the heat dissipation device is reduced and the thermal resistance of the heat dissipation device is lowered.
Claims16
A heat dissipation device comprising:
- a first board body having a first face and a second face, the second face being formed with a rough structure;
- and
- a second board body having a third face and a fourth face, the fourth face of the second board body being mated with the second face of the first board body and covered by the second face, the second and fourth faces together defining a chamber, a working fluid being filled in the chamber.
Dependencies are inferred from the claim text.