Back to results
US 2014/0174649 A1Published application
Surface treatment by chlorinated plasma in a bonding method
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorClaire AGRAFFEIL
Life of this patent
Estimating the term…
Abstract
The bonding method of two silicon-based surfaces includes the steps of: subjecting at least one of the surfaces to surface activation treatment by means of an oxygen plasma comprising chlorine, the dilution percentage by volume of the chlorine in the oxygen of the plasma being from 0.25 to 10%, preferably from 1 to 3%, placing the treated surfaces in contact.
Claims10
Bonding method of two silicon-based surfaces, comprising the following successive steps:
- subjecting at least one of the surfaces to surface activation treatment by means of an oxygen plasma comprising chlorine, the dilution percentage by volume of the chlorine in the oxygen of the plasma being from 0.25 to 10%,
- placing the treated surfaces in contact.
Dependencies are inferred from the claim text.