Waveguide for intra-package data transfer

An integrated chip (IC) package, comprising:

• a waveguide comprising a cavity;
• a first chip including a first radio frequency (RF) transceiver coupled to a first antenna positioned over a first opening of the waveguide;
• a second chip including a second RF transceiver coupled to a second antenna positioned over a second opening of the waveguide;
• and
• a third chip including a third RF transceiver coupled to a third antenna positioned over a third opening of the waveguide;
• wherein the first, second, and third chips are configured to communicate with one another exclusively by transmitting and receiving RF signals by the first, second, and third RF transceivers through the cavity of the waveguide via the first, second, and third antennas.

An integrated chip (IC) package, comprising:

• a first conductive layer over a second conductive layer with a cavity therebetween;
• and
• a plurality of chips each comprising a radio frequency (RF) transceiver configured to transmit and receive radio frequency (RF) signals through the cavity;
• wherein the plurality of chips of the IC package exclusively communicate with one another by transmitting and receiving the RF signals through the cavity.