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US 2014/0154960 A1Published application
Cmp pad conditioner
AssigneeEhwa Diamond Industrial Co., Ltd.
InventorsSeh Kwang Lee, Joo Han Lee
Life of this patent
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Abstract
The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.
Claims18
A chemical mechanical polishing (CMP) pad conditioner, comprising:
- a substrate;
- and
- cutting tip patterns formed on at least one surface of the substrate, the cutting tip patterns comprised of:
- a plurality of substrate tip portions spaced apart from each other on the substrate;
- and
- diamond deposition tip portions formed on the plurality of substrate tip portions.
3 more elements
A chemical mechanical polishing (CMP) pad conditioner, comprising:
- a substrate;
- and
- cutting tip patterns formed on at least one surface of the substrate, the cutting tip patterns comprised of:
- diamond deposition tip portions;
- and
- a plurality of substrate tip portions spaced apart from each other on the substrate, the plurality of substrate tip portions comprising a first plurality of substrate tip portions on which the diamond deposition tip portions are formed and a second plurality of substrate tip portions on which the diamond deposition tip portions are not formed.
3 more elements
Dependencies are inferred from the claim text.