Pad Conditioning and Wafer Retaining Ring and Manufacturing Method Thereof
AssigneeEhwa Diamond Industrial Co., Ltd.
InventorsSeh Kwang LEE, Joo Han LEE, Kwan Hee PARK
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Abstract
The present invention relates to a wafer retaining ring used in a chemical mechanical polishing process (CMP) for semiconductor device manufacturing, and in particular, to a pad conditioning and wafer retaining ring designed to prevent a wafer from slipping during the CMP process and, simultaneously condition a pad uniformly, and to a manufacturing method thereof.
Claims18
A pad conditioning and wafer retaining ring for preventing a wafer from slipping during a chemical mechanical polishing (CMP) process, the pad conditioning and wafer retaining ring having a plurality of cutting tips, each cutting tip comprised of a plurality of protrusions, the plurality of cutting tips formed to be spaced at a predetermined distance from each other on the surface of the pad conditioning and wafer retaining ring to function as a pad conditioner.
A method for manufacturing a pad conditioning and wafer retaining ring, the method comprising:
- preparing a ring-shaped substrate having a determined thickness and width;
- forming on the surface of the ring-shaped substrate a plurality of grooves having a predetermined width and depth at a predetermined interval so as to extend from the outer circumference to the inner circumference of the ring-shaped substrate;
- and
- forming on the surface of the ring-shaped substrate between the plurality of grooves a plurality of cutting tips having a plurality of protrusions at a predetermined interval formed to be spaced at a predetermined distance from each other.
Dependencies are inferred from the claim text.