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US 2014/0154884 A1Published application
Erosion inhibitor for chemical mechanical polishing, slurry for chemical mechanical polishing, and chemical mechanical polishing method
AssigneeKuraray Co., Ltd.
InventorsMitsuru Kato, Minori Takegoshi, Chihiro Okamoto, Shinya Kato
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Abstract
The present invention provides an erosion inhibitor for chemical mechanical polishing, which contains compound (a) having a molecular weight of not more than 100,000 and not less than 4 hydroxyl groups, and compound (b) having not less than 4 amino groups, and which has a mass ratio of the compound (a) and the compound (b) (the compound (a)/the compound (b)) of 0.10-500.
Claims15
An erosion inhibitor for chemical mechanical polishing, comprising:
- a compound (a) having a molecular weight of not more than 100,000 and comprising not less than 4 hydroxyl groups, and
- a compound (b) comprising not less than 4 amino groups,
- wherein a mass ratio of the compound (a) and the compound (b) is 0.10-500.
Dependencies are inferred from the claim text.