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US 2014/0154873 A1Published application
Dislocation engineering using a scanned laser
AssigneeInternational Business Machines Corporation
InventorsChung Woh Lai, Xiao Hu Liu, Anita Madan, Klaus W. Schwarz, J. Campbell Scott
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Abstract
A system for manipulating dislocations on semiconductor devices, includes a moveable laser configured to generate a laser beam locally on a surface portion of the semiconductor body having a plurality of dislocations, the moveable laser being characterized as having a scan speed, the moveable laser manipulates the plurality of dislocations on the surface portion of the semiconductor body by adjusting the temperature and the scan speed of the laser beam.
Claims2
A method for manipulating dislocations from a semiconductor device, comprising:
- directing a light-emitting beam locally onto a surface portion of a semiconductor body that includes active regions of the semiconductor device;
- and
- manipulating a plurality of dislocations located proximate to the surface portion of the semiconductor body utilizing the light-emitting beam;
- wherein manipulating the plurality of dislocations comprises directly scanning the plurality of dislocations with the light-emitting beam to manipulate a size of the plurality of dislocations on the surface portion of the semiconductor body by adjusting a temperature of the surface portion of the semiconductor body corresponding to the plurality of dislocations and adjusting a scan speed of the laser beam.
1 more element
Dependencies are inferred from the claim text.